Interfacial reactions between Sn-2.5Ag-2.0Ni solder and
electroless Ni(P) deposited on SiCp/Al composites
WUMao(吴茂),QUXuan-hui(曲选辉),HEXin-bo(何新波),Rafi-ud-din,RENShu-bin(任淑彬),QINMing-li(秦明礼)
Interfacial reactions between Sn-2.5Ag-2.0Ni solder and
electroless Ni(P) deposited on SiCp/Al composites
WUMao(吴茂),QUXuan-hui(曲选辉),HEXin-bo(何新波),Rafi-ud-din,RENShu-bin(任淑彬),QINMing-li(秦明礼)
中国有色金属学报（英文版）
.
2010, (06): 958
-965
.
