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Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints
G.MAHENDRAN,V.BALASUBRAMANIAN,T.SENTHILVELAN
Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints
G.MAHENDRAN,V.BALASUBRAMANIAN,T.SENTHILVELAN
中国有色金属学报(英文版) . 2010, (06): 997 -1005 .