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Influence of interfacial reaction between molten
SnAgCu solder droplet and
Au/Ni/Cu pad on IMC evolution
匿名
Influence of interfacial reaction between molten
SnAgCu solder droplet and
Au/Ni/Cu pad on IMC evolution
LI Fu-quan(李福泉), WANG Chun-qing(王春青)
中国有色金属学报(英文版) . 2006, (01): 18 -18 .