Microstructures and properties of Sn-Ag-Cu lead-free
solder alloys containing La
ZHOUYing-chun(周迎春),PANQing-lin(潘清林),HEYun-bin(何运斌),LIANGWen-jie(梁文杰)LIWen-bin(李文斌),LIYun-chun(李运春),LUCong-ge(路聪阁)
Microstructures and properties of Sn-Ag-Cu lead-free
solder alloys containing La
ZHOUYing-chun(周迎春),PANQing-lin(潘清林),HEYun-bin(何运斌),LIANGWen-jie(梁文杰)LIWen-bin(李文斌),LIYun-chun(李运春),LUCong-ge(路聪阁)
中国有色金属学报（英文版）
.
2007, (Special 1): 1043
-1048
.
