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Preparation of SiCp/A356 electronic packaging materials and its thixo-forging
WANGKai-kun(王开坤),KANGYong-lin(康永林),SONGPu-guang(宋普光),XUFeng(徐 峰),LIXian-hui(黎先辉)
Preparation of SiCp/A356 electronic packaging materials and its thixo-forging
WANGKai-kun(王开坤),KANGYong-lin(康永林),SONGPu-guang(宋普光),XUFeng(徐 峰),LIXian-hui(黎先辉)
中国有色金属学报(英文版) . 2010, (Special 3): 988 -992 .