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Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material
Jun-SikLEE,Jun-KiKIM,Mok-SoonKIM,NamhyunKANG,Jong-HyunLEE
Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material
Jun-SikLEE,Jun-KiKIM,Mok-SoonKIM,NamhyunKANG,Jong-HyunLEE
中国有色金属学报(英文版) . 2011, (Special 1): 175 -181 .