电子封装材料过共晶硅-铝合金的组织特征和热性能
余琨,李少君,陈立三,赵为上,李鹏飞
Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications
YUKun,LIShao-jun,CHENLi-san,ZHAOWei-shang,LIPeng-fei
中国有色金属学报(英文版)
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2012, (6): 1412
-1417
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