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Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting
匿名
Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting
ZHOU Ling-ping(周灵平), , WANG Ming-pu(汪明朴), WANG Rui(王 瑞),LI Zhou(李 周), ZHU Jia-jun(朱家俊), PENG Kun(彭 坤),LI De-yi(李德意), LI Shao-lu(李绍禄)
中国有色金属学报(英文版) . 2008, (02): 372 -377 .