欢迎访问《中国冶金》官方网站!今天是
Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate
匿名
Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate
TIAN Yan-hong(田艳红), WANG Chun-qing(王春青), Y. Norman ZHOU
中国有色金属学报(英文版) . 2008, (01): 132 -132 .