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Effect of solidification on solder bump formation in solder jet process: Simulation and experiment
匿名
Effect of solidification on solder bump formation in solder jet process: Simulation and experiment
TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红)
中国有色金属学报(英文版) . 2008, (05): 1201 -1208 .