电子封装用Al-50%SiC复合材料的组织和性能
滕飞,余琨,罗杰,房宏杰,史春丽,戴翌龙,熊汉青
Microstructures and properties of Al-50%SiC composites for electronic packaging applications
FeiTENG,KunYU,JieLUO,Hong-jieFANG,Chun-liSHI,Yi-longDAI,Han-qingXIONG
中国有色金属学报(英文版)
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2016, (10): 2647
-2652
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