快速热冲击下SAC305/Cu焊点氧化行为与金属间化合物生长动力学
吴鸣,王善林,尹立孟,陈玉华,洪敏,孙文君,姚宗湘,倪佳明,卢鹏,张体明,谢吉林
Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock
MingWU,Shan-linWANG,Li-mengYIN,Yu-huaCHEN,MinHONG,Wen-junSUN,Zong-xiangYAO,Jia-mingNI,PengLU,Ti-mingZHANG,Ji-linXIE
中国有色金属学报（英文版）
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2023, (10): 3054
-3066
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DOI: 10.1016/S1003-6326(23)66317-4
