铜基体上SnPbInBiSb高熵钎料焊点界面金属间化合物的生长动力学
王 帅，冯佳运，王 玮，曹文超，丁 鑫，王 尚，田艳红
Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates
Shuai WANG, Jia-yun FENG, Wei WANG, Wen-chao CAO, Xin DING, Shang WANG, Yan-hong TIAN
中国有色金属学报（英文版）
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2024, (11): 3650
-3661
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