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Creep behavior on Ag particle reinforced SnCu based composite solder joints
YANYan-fu(闫焉服),ZHUJin-hong(朱锦洪),CHENFu-xiao(陈拂晓), HEJun-guang(贺俊光),YANGDi-xin(杨涤心) 
Creep behavior on Ag particle reinforced SnCu based composite solder joints
YANYan-fu(闫焉服),ZHUJin-hong(朱锦洪),CHENFu-xiao(陈拂晓), HEJun-guang(贺俊光),YANGDi-xin(杨涤心) 
中国有色金属学报(英文版) . 2006, (05): 1116 -1120 .