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非对称结构Cu/Sn-58Bi/Cu焊点中 电迁移致组织演变及损伤
岳 武,秦红波,周敏波,马 骁,张新平
Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing
WuYUE,Hong-boQIN,Min-boZHOU,XiaoMA,Xin-pingZHANG
中国有色金属学报(英文版) . 2014, (5): 1619 -1628 .