轧制与退火处理对粉末冶金Cu/Invar电子封装复合材料结构和性能的影响
吴丹,杨磊,史常东,吴玉程,汤文明,
Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy
DanWU,LeiYANG,Chang-dongSHI,Yu-chengWU,Wen-mingTANG,
中国有色金属学报（英文版）
.
2015, (6): 1995
-2002
.
