瞬态电流键合对Ag修饰石墨烯Sn-Ag-Cu复合焊点界面反应的影响
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Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints
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中国有色金属学报（英文版）
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2021, (8): 2454
-2467
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DOI: 10.1016/S1003-6326(21)65666-2
