低温下SnAgCu-SnPb混装焊点断裂模式演变规律
吴 鸣,王善林,孙文君,洪 敏,陈玉华,柯黎明
Fracture pattern evolution of SnAgCu-SnPb mixed solder joints at cryogenic temperature
Ming WU, Shan-lin WANG, Wen-jun SUN, Min HONG, Yu-hua CHEN, Li-ming KE
中国有色金属学报（英文版）
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2021, (9): 2762
-2772
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DOI: 10.1016/S1003-6326(21)65691-1
