Cu含量对Sn-xCu无铅焊料显微组织、晶粒取向和力学性能的影响
KannachaiKANLAYASIRI,NiwatMOOKAM
Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn-xCu lead-free solders
KannachaiKANLAYASIRI,NiwatMOOKAM
中国有色金属学报（英文版）
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2022, (4): 1226
-1241
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DOI: 10.1016/S1003-6326(22)65869-2
