Fracture pattern evolution of SnAgCu-SnPb mixed solder joints at cryogenic temperature

Ming WU, Shan-lin WANG, Wen-jun SUN, Min HONG, Yu-hua CHEN, Li-ming KE

Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (9) : 2762-2772.

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Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (9) : 2762-2772. DOI: 10.1016/S1003-6326(21)65691-1
Materials Science and Engineering

Fracture pattern evolution of SnAgCu-SnPb mixed solder joints at cryogenic temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 31(9): 2762-2772 https://doi.org/10.1016/S1003-6326(21)65691-1

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