Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper

L. E. BODROVA, S. Yu. MELCHAKOV, A. B. SHUBIN, E. Yu. GOYDA

Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (9) : 2773-2786.

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Transactions of Nonferrous Metals Society of China ›› 2021, Vol. 31 ›› Issue (9) : 2773-2786. DOI: 10.1016/S1003-6326(21)65692-3
Materials Science and Engineering

Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 31(9): 2773-2786 https://doi.org/10.1016/S1003-6326(21)65692-3

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