Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn-xCu lead-free solders

KannachaiKANLAYASIRI,NiwatMOOKAM

Transactions of Nonferrous Metals Society of China ›› 2022, Vol. 32 ›› Issue (4) : 1226-1241.

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Transactions of Nonferrous Metals Society of China ›› 2022, Vol. 32 ›› Issue (4) : 1226-1241. DOI: 10.1016/S1003-6326(22)65869-2
Materials Science and Engineering

Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn-xCu lead-free solders

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 32(4): 1226-1241 https://doi.org/10.1016/S1003-6326(22)65869-2

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