Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint

JieWU*,Guo-qiangHUANG*,Song-baiXUE,PengXUE,YongXU

Transactions of Nonferrous Metals Society of China ›› 2022, Vol. 32 ›› Issue (10) : 3312-3320.

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Transactions of Nonferrous Metals Society of China ›› 2022, Vol. 32 ›› Issue (10) : 3312-3320. DOI: 10.1016/S1003-6326(22)66022-9
Materials Science and Engineering

Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 32(10): 3312-3320 https://doi.org/10.1016/S1003-6326(22)66022-9

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