Microstructure characterization of (Sn1-xZnx)57(In0.78Bi0.22)43 low melting point lead-free solder materials

Tian-yu ZHANG, Qing CHENG, Heng-yu ZHU, Qin-qin WEI, Xian-dong XU

Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (1) : 201-208.

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Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (1) : 201-208. DOI: 10.1016/S1003-6326(22)66100-4
Materials Science and Engineering

Microstructure characterization of (Sn1-xZnx)57(In0.78Bi0.22)43 low melting point lead-free solder materials

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 33(1): 201-208 https://doi.org/10.1016/S1003-6326(22)66100-4

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