Formation of ductile close-packed hexagonal solid solution on improving shear strength of Au-Ge/Cu soldering joint

MengWANG,JianPENG

Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (8) : 2449-2460.

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Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (8) : 2449-2460. DOI: 10.1016/S1003-6326(23)66272-7
Materials Science and Engineering

Formation of ductile close-packed hexagonal solid solution on improving shear strength of Au-Ge/Cu soldering joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 33(8): 2449-2460 https://doi.org/10.1016/S1003-6326(23)66272-7

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