Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock

MingWU,Shan-linWANG,Li-mengYIN,Yu-huaCHEN,MinHONG,Wen-junSUN,Zong-xiangYAO,Jia-mingNI,PengLU,Ti-mingZHANG,Ji-linXIE

Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (10) : 3054-3066.

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Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (10) : 3054-3066. DOI: 10.1016/S1003-6326(23)66317-4
Materials Science and Engineering

Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 33(10): 3054-3066 https://doi.org/10.1016/S1003-6326(23)66317-4

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