Microstructure and properties of Al-Si functionally graded materials for electronic packaging

WeiZHOU,Ri-chuWANG,Chao-qunPENG,Zhi-yongCAI,

Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (12) : 3583-3596.

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Transactions of Nonferrous Metals Society of China ›› 2023, Vol. 33 ›› Issue (12) : 3583-3596. DOI: 10.1016/S1003-6326(23)66356-3
Materials Science and Engineering

Microstructure and properties of Al-Si functionally graded materials for electronic packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 33(12): 3583-3596 https://doi.org/10.1016/S1003-6326(23)66356-3

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