Effect of Ag content on microstructure and mechanical properties of Sn-xAg-0.5Cu solder joints under rapid thermal shock

Chen PENG, Shan-lin WANG, Ming WU, Li-meng YIN, Yu-hua CHEN, Ke-jiang YE, Wei-zheng CHEN, Ti-ming ZHANG, Ji-lin XIE

Transactions of Nonferrous Metals Society of China ›› 2024, Vol. 34 ›› Issue (6) : 1922-1935.

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Transactions of Nonferrous Metals Society of China ›› 2024, Vol. 34 ›› Issue (6) : 1922-1935. DOI: 10.1016/S1003-6326(24)66516-7
Materials Science and Engineering

Effect of Ag content on microstructure and mechanical properties of Sn-xAg-0.5Cu solder joints under rapid thermal shock

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 34(6): 1922-1935 https://doi.org/10.1016/S1003-6326(24)66516-7

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