Mechanisms of ductile-to-brittle transition in Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature

Sheng-li LI, Chun-jin HANG, Qi-long GUAN, Xiao-jiu TANG, Ning ZHOU, Yan-hong TIAN, Wei ZHANG, Dan YU, Ying DING, Xiu-li WANG

Transactions of Nonferrous Metals Society of China ›› 2025, Vol. 35 ›› Issue (4) : 1281-1291.

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Transactions of Nonferrous Metals Society of China ›› 2025, Vol. 35 ›› Issue (4) : 1281-1291. DOI: 10.1016/S1003-6326(24)66748-8
Materials Science and Engineering

Mechanisms of ductile-to-brittle transition in Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 35(4): 1281-1291 https://doi.org/10.1016/S1003-6326(24)66748-8

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