Relationship between current density and microstructure of Ti60 alloy during multi-physical field coupling process

Ren-hai YU, Ke-min XUE, Si-liang YAN, Ping LI 

Transactions of Nonferrous Metals Society of China ›› 2026, Vol. 36 ›› Issue (9) : 2686-2700.

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Transactions of Nonferrous Metals Society of China ›› 2026, Vol. 36 ›› Issue (9) : 2686-2700. DOI: 10.1016/S1003-6326(26)67119-1
MATERIALS SCIENCE AND ENGINEERING

Relationship between current density and microstructure of Ti60 alloy during multi-physical field coupling process

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 36(9): 2686-2700 https://doi.org/10.1016/S1003-6326(26)67119-1

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