Solder joint geometry of tin-lead alloy and its application in electronic packaging

Wang Guozhong(王国忠); Zhu Qinong(朱其农); Cheng Zhaonian(程兆年); Wang Chunqing(王春青); Qian Yiyu(钱乙余)

Transactions of Nonferrous Metals Society of China ›› 1999, Vol. 9 ›› Issue (04) : 733-740.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 1999, Vol. 9 ›› Issue (04) : 733-740.
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Solder joint geometry of tin-lead alloy and its application in electronic packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 1999, 9(04): 733-740

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