Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer①

YU Zhi-shui(于治水), WANG Feng-jiang(王凤江), LI Xiao-quan(李晓泉), WU Ming-fang(吴铭芳)

Transactions of Nonferrous Metals Society of China ›› 2000, Vol. 10 ›› Issue (01) : 88-91.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2000, Vol. 10 ›› Issue (01) : 88-91.
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Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer①

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 10(01): 88-91

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