Transient liquid phase diffusion bonding of copper alloy to
stainless steel using CuMn alloys as interlayer①

YUZhi-shui(于治水),WANGFeng-jiang(王凤江),LIXiao-quan(李晓泉),WANGYu(王宇),WUMing-fang(吴铭方)

Transactions of Nonferrous Metals Society of China ›› 2000, Vol. 10 ›› Issue (03) : 349-352.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2000, Vol. 10 ›› Issue (03) : 349-352.
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Transient liquid phase diffusion bonding of copper alloy to
stainless steel using CuMn alloys as interlayer①

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 10(03): 349-352

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