Finite element simulation for mechanical
response of surface mounted solder joints
under different temperature cycling

MAXin(马鑫),QIANYi-yu(钱乙余),F.Yoshida

Transactions of Nonferrous Metals Society of China ›› 2001, Vol. 11 ›› Issue (04) : 471-474.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2001, Vol. 11 ›› Issue (04) : 471-474.
MATERIALS SCIENCE AND ENGINEERING

Finite element simulation for mechanical
response of surface mounted solder joints
under different temperature cycling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2001, 11(04): 471-474

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