Numeric simulation of thickness of intermetallic compounds in
interface zone of diffusion bonding for Cu and Al

LI Ya-jiang(李亚江), WU Hui-qiang(吴会强), CHEN Mao-ai(陈茂爱), FENG Tao(冯  涛)

Transactions of Nonferrous Metals Society of China ›› 2001, Vol. 11 ›› Issue (06) : 908-911.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2001, Vol. 11 ›› Issue (06) : 908-911.
MATERIALS SCIENCE AND ENGINEERING

Numeric simulation of thickness of intermetallic compounds in
interface zone of diffusion bonding for Cu and Al

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2001, 11(06): 908-911

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