Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film

HEHan-wei(何捍卫),HUYue-hua(胡岳华),ZHOUKe-chao(周科朝),XIONGXiang(熊翔),HUANGBai-yun(黄伯云)

Transactions of Nonferrous Metals Society of China ›› 2003, Vol. 13 ›› Issue (04) : 977-981.

Transactions of Nonferrous Metals Society of China ›› 2003, Vol. 13 ›› Issue (04) : 977-981.
MINING, MINERAL PROCESSING, METALLURGY AND CHEMIST

Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2003, 13(04): 977-981

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