Interface evolution of TiAl/Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals
DUANHui-ping(段辉平),K.H.Bohm,V.Ventzke,M.Koçak
Transactions of Nonferrous Metals Society of China ›› 2005, Vol. 15 ›› Issue (02) : 375-378.
Interface evolution of TiAl/Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals
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