Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

HUANGChun-yue(黄春跃),WUZhao-hua(吴兆华), HUANGHong-yan(黄红艳),ZHOUDe-jian(周德俭)

Transactions of Nonferrous Metals Society of China ›› 2005, Vol. 15 ›› Issue (04) : 807-812.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2005, Vol. 15 ›› Issue (04) : 807-812.
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Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 15(04): 807-812

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