Influence of interfacial reaction between molten
SnAgCu solder droplet and
Au/Ni/Cu pad on IMC evolution

LI Fu-quan(李福泉), WANG Chun-qing(王春青)

Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (01) : 18-18.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (01) : 18-18.
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Influence of interfacial reaction between molten
SnAgCu solder droplet and
Au/Ni/Cu pad on IMC evolution

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 16(01): 18-18

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