Effects of cooling rates on microstructure and
microhardness of lead-free Sn-3.5%Ag solders

SHENJun(沈骏),LIUYong-chang(刘永长),HANYa-jing(韩雅静),GAOHou-xiu(高后秀),WEIChen(韦晨),YANGYu-qin(杨渝钦)

Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (01) : 59-59.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (01) : 59-59.
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Effects of cooling rates on microstructure and
microhardness of lead-free Sn-3.5%Ag solders

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 16(01): 59-59

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