Creep behavior on Ag particle reinforced SnCu based composite solder joints

YANYan-fu(闫焉服),ZHUJin-hong(朱锦洪),CHENFu-xiao(陈拂晓), HEJun-guang(贺俊光),YANGDi-xin(杨涤心) 

Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (05) : 1116-1120.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (05) : 1116-1120.
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Creep behavior on Ag particle reinforced SnCu based composite solder joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 16(05): 1116-1120

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