Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

WANGJian-xin(王俭辛),XUESong-bai(薛松柏),FANGDian-song(方典松), JUJin-long(鞠金龙),HANZong-jie(韩宗杰),YAOLi-hua(姚立华)<

Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (06) : 1374-1378.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2006, Vol. 16 ›› Issue (06) : 1374-1378.
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Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 16(06): 1374-1378

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