Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

ZHAOXiao-yan(赵小艳),ZHAOMai-qun(赵麦群),CUIXiao-qing(崔小清),XUTian-han(许天旱),TONGMing-xin(仝明信)

Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (04) : 805-805.

Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (04) : 805-805.
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Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 17(04): 805-805

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