Fabrication and characterization of high dense Mo/Cu composites for
electronic packaging applications
CHENGuo-qin(陈国钦),JIANGLong-tao(姜龙涛),WUGao-hui(武高辉),ZHUDe-zhi(朱德志),XIUZi-yang(修子扬)
Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (Special 1) : 580-583.
Fabrication and characterization of high dense Mo/Cu composites for
electronic packaging applications
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