Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

TIAN Yan-hong(田艳红), WANG Chun-qing(王春青), Y. Norman ZHOU

Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (01) : 132-132.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (01) : 132-132.
Functional Materials

Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 18(01): 132-132

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