Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting

ZHOU Ling-ping(周灵平), , WANG Ming-pu(汪明朴), WANG Rui(王 瑞),LI Zhou(李 周), ZHU Jia-jun(朱家俊), PENG Kun(彭 坤),LI De-yi(李德意), LI Shao-lu(李绍禄)

Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (02) : 372-377.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (02) : 372-377.
Functional Materials

Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 18(02): 372-377

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