Effect of solidification on solder bump formation in solder jet process: Simulation and experiment

TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红)

Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (05) : 1201-1208.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2008, Vol. 18 ›› Issue (05) : 1201-1208.
Computational Materials Science

Effect of solidification on solder bump formation in solder jet process: Simulation and experiment

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 18(05): 1201-1208

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