Preparation and properties of SiCN diffusion barrier layer for
Cu interconnect in ULSI

ZHOUJi-cheng(周继承),SHIZhi-jie(石之杰),ZHENGXu-qiang(郑旭强)

Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (03) : 611-615.

Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (03) : 611-615.
Functional Materials

Preparation and properties of SiCN diffusion barrier layer for
Cu interconnect in ULSI

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 19(03): 611-615

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail

Sections
Recommended

/