Characterization of flexible copper laminates fabricated by Cu electro-plating process

Chang-MinLEE,Jun-HyungLIM,Soo-MinHWANG,Eui-CheolPARK,Jong-HyunSHIM,Jin-HyunPARK,JinhoJOO,Seung-BooJUNG

Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (04) : 965-969.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2009, Vol. 19 ›› Issue (04) : 965-969.
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Characterization of flexible copper laminates fabricated by Cu electro-plating process

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 19(04): 965-969

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