Solid state interfacial reactions in electrodeposited Cu/Sn couples

TANGWen-ming(汤文明),HEAn-qiang,LIUQi,D.G.IVEY

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (01) : 90-92.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (01) : 90-92.
Functional Materials

Solid state interfacial reactions in electrodeposited Cu/Sn couples

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(01): 90-92

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